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Huawei’s Kirin 9050 highlights 3D stacking and Tau Law ahead of the Mate 90 launch
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Huawei’s Kirin 9050 highlights 3D stacking and Tau Law ahead of the Mate 90 launch

Huawei plans to introduce the Kirin 9050 with the Mate 90 series this fall, with September 2026 indicated for the phone launch window. Reports tied to industry channels and an ISCAS 2026 conference presentation describe the chip as moving past Apple’s A18 while nearing first-generation 3nm-class density. The central issue is whether 3D IC stacking and Tau Law can deliver high-end results without relying on the most advanced EUV lithography tools.

May 31, 2026Read More →
Israel eyes Philippines as a key partner in 'Pax Silica' initiative
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Israel eyes Philippines as a key partner in 'Pax Silica' initiative

Israel’s ambassador to the Philippines said the country could be a key partner in the US-led Pax Silica initiative for AI and semiconductor supply chains. The proposed fit combines Philippine critical minerals, including nickel, with Israeli capabilities in AI, chip design and cybersecurity. Officials are also discussing a critical minerals memorandum, while a separate cybersecurity MOU is being finalized.

May 30, 2026Read More →