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FuriosaAI and Broadcom Target the Next Layer of AI Inference Infrastructure
FuriosaAI said it will work with Broadcom on a next-generation AI inference platform built around its TCP architecture and Broadcom networking and packaging technologies.
The planned third-generation accelerator will use a 2-nanometer compute die, HBM4/HBM4E memory and multi-die packaging, with sampling planned for the first half of 2028.
The deal points to AI infrastructure competition shifting from single-chip performance toward memory, networking, power efficiency and rack-level system design.