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Chips & SemiconductorsNews|June 20, 2026, 03:48 AM
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SK hynix Uses HPE Discover to Push AI Memory Beyond HBM

BySendTech Times DeskNewsroom-edited technology coverage|Source: SK hynix Newsroom
Newsroom brief

SK hynix used HPE Discover 2026 in Las Vegas to showcase HBM, CMM-DDR5, eSSD and server DRAM products for AI infrastructure buyers. The company said HPE-certified products already deployed in HPE servers include PS1010 E3.S eSSDs based on 176-layer 4D NAND and 64GB DDR5 RDIMM modules built on 1c process technology. The clearest commercial point is HPE certification and supply; the booth display does not by itself show broader customer adoption.

Verified against source materialEdited by SendTech Times Desk
SK hynix Uses HPE Discover to Push AI Memory Beyond HBM
Image source: SK hynix Newsroom

SK hynix used HPE Discover 2026 to present a broader AI memory portfolio for HPE server systems, placing CXL memory, enterprise SSDs and server DRAM alongside its better-known HBM line.

HPE Discover Becomes an AI Memory Showcase

HPE held HPE Discover Las Vegas 2026 from June 15 to 18 at The Venetian Convention and Expo Center in Las Vegas, with the program focused on AI, cloud and networking.

SK hynix used the event to reinforce its partnership with HPE and to showcase products it said are already certified for HPE server systems.

The story extends beyond high-bandwidth memory.

SK hynix organized its booth into four product zones: HBM, CMM-DDR5, eSSD and server DRAM.

Training and inference systems need more than accelerator memory.

They also require expandable system memory, fast storage and server modules that fit into data-center platforms.

HBM4 Sits Beside CXL Memory

The HBM area centered on a model of Nvidia’s Vera Rubin superchip, showing where HBM4 would sit in a next-generation AI computing design.

SK hynix presented its HBM lineup across three reference points: 16-layer 48GB HBM4 as the highest-capacity product shown, 12-layer 36GB HBM4 as another next-generation option, and 12-layer 36GB HBM3E as the current comparison point.

The CXL section carried a different message.

SK hynix showed a first-generation CMM-DDR5 product with 128GB and CXL 2.0+, then placed it next to a second-generation version with 256GB and CXL 3.2.

The company also showed CMM-DDR5 inside Liqid’s CXL Pooled Memory Server, offering a practical interoperability example for buyers evaluating memory expansion beyond standard server slots.

HPE Certification Gives the Booth a Commercial Anchor

The most concrete commercial detail is HPE certification.

SK hynix said it has completed certification and is supplying HPE with PS1010 E3.S data-center eSSDs based on 176-layer 4D NAND, along with 64GB DDR5 RDIMM server DRAM built on 10-nanometer-class sixth-generation 1c process technology.

The eSSD display covered several server-storage form factors.

SK hynix listed U.3 products from the PS1010/1030 and PE1010/1030 lines, E3.S products from the same PS and PE families, and additional SE5110 SATA3, PE9010 M.2 2280 and PEB210 M.2 2280 drives.

On the DRAM side, SK hynix showed 128GB, 96GB and 64GB DDR5 RDIMM modules, plus a 256GB 3DS RDIMM and 192GB SOCAMM2.

SK hynix also used a technical session to connect the hardware display to memory architecture.

Byeonho Koo of DRAM Solution and Yunjay Hong of DRAM System Analysis presented CXL pooled memory, Processing-Near-Memory and the HMSDK heterogeneous memory management tool as ways to address rising memory-capacity and bandwidth pressure from AI inference workloads.

The remaining question for buyers is the breadth of deployment.

HPE certification and named modules make the partnership more tangible than a generic booth claim, but SK hynix did not disclose additional customer names, shipment volumes or production-scale adoption for the full portfolio shown in Las Vegas.

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